All stock codes associated to this product
HTK002U1, HTK-002-U1, CMACHTK002U1, CM-AC-HTK002U1, 745883579549, 836837001053
Cooler Master HTK002 High Performance Thermal Compound
Kit
Overview
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone
materials, heavily filled with heat conductive metal oxides. This combination
promotes high thermal conductivity, low bleed and high-temperature stability.
These compounds resist changes in consistency at temperatures up to 177 C (350
F), maintaining a positive heat sink seal to improve heat transfer from the
electronic device to the heat sink or chassis, thereby, increasing the overall
efficiency of the device.
Features
- Suitable for CPU, chipsets on Mainboard, VGA card, etc.
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket
types.
- Produces an even layer when using applicator
- Dielectric.
- Wide range of application temperature
*Since air is known as a poor heat conductor, it should be replaced by a more
conductive material to improve heat flow across thermal interfaces.
Cautions
- For industrial use only.
- Keep out of the reach of children.
- Do not swallow!
- Avoid contact with eyes.
- Please read the instructions prior to installation.
Specifications
|
Color |
: |
White |
|
Specific
Gravity |
: |
2.37 |
|
Viscosity/Flowability |
: |
Nonflowing |
|
Shelf
Life |
: |
24 months from
DOM |
|
Thermal
Conductivity |
: |
0.8
watts/meter-C |
|
Volume
Resistivity |
: |
5.0 x
1015 |
|
Dielectric
Constant |
: |
4.4 at 100k
Hz |
|
Dissipation
Factor |
: |
0.02 at 100k
Hz |
|
Dielectric
Strength |
: |
550 volts/mil; 21.7
kV/mm |
