All stock codes associated to this product
NT-H2-3.5G-AM5, NTH23.5GAM5, NTH235GAM5
Noctua NT-H2 3.5g AM5 Thermal Compound Tube with NA-STPG1 Thermal Paste Guard
NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance, NT-H2 is an enthusiast-grade paste for the highest demands. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results and thanks to the included cleaning wipes, it is just as easy to remove as to apply. The AM5 Edition also includes the NA-TPG1 thermal paste guard that prevents thermal paste build-up in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.
Specifications
Recommended storage time (before use)
up to 3 years
Recommended usage time (on the CPU)
up to 5 years
Recommended storage temperature
room temperature
Operating temperature
-50 to 200C
Scope of delivery
- NT-H2 high-grade thermal compound
- NA-STPG1 thermal paste guard
- 3x NA-CW1 cleaning wipes
Based on the award-winning NT-H1
NT-H2 is based on Noctuas renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Chosen again and again by overclockers and enthusiast users worldwide, NT-H1 has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
Next-generation performance
Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture of metal oxide micro-particles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieveeven better performancein most application scenarios.
AM5 Edition with thermal paste guard
When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heatspreader and may become difficult to remove. Simple and risk-free to apply, the NA-TPG1 prevents this undesired phenomenon.
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H2 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and youre ready to go!
Easy to clean with included wipes
The 3.5g pack of NT-H2 includes three large NA-CW1 cleaning wipes that are pre-moistened with an isopropyl alcohol mixture and make it childs play to remove: Simply wipe off the paste from the CPU and the base of the cooler using one of the wipes and youre done!
Optional NA-SCW1 set for power users
Power users who take off and install their coolers frequently can purchase the optionalNA-SCW1set that contains 20 pieces of the NA-CW1 cleaning wipes, which are ideal for removing NT-H2 from the heat-spreader of the CPU and the contact surface of the heatsink.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, theres no risk of short-circuits with NT-H2 and its completely safe to use with any type of CPU cooler, regardless of whether its made from copper or aluminium and whether its nickel-plated or not.
Excellent long-term stability
NT-H2 unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compounds exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H2 is ready to go right away and doesnt require any special preparations.
3.5g package for 3-20 applications
Sufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4, 15 for AM4/AM5 or LGA1700, and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then.