All stock codes associated to this product
HX432C16FB3K2/16, 4592134, 740617296341
HyperX HX432C16FB3K2/16 16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4-3200 CL16 288-Pin DIMM Kit
Description
HyperX HX432C16FB3K2/16 is a kit of two 1G x 64-bit (8GB) DDR4-3200 CL16
SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA
components per module. Each module kit supports Intel Extreme Memory Profiles
(Intel XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run
at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V. The SPDs are
programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each
288-pin DIMM uses gold contact fingers.
Features
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP = 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- On-Die termination (ODT)
- 16 internal banks; 4 groups of 4 banks each
- Bi-Directional Differential Data Strobe
- 8 bit pre-fetch
- Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
- Height 1.3425 (34.1mm), w/heatsink
Specifications
CL(IDD) |
17
cycles |
Row Cycle Time
(tRCmin) |
45.75ns(min.) |
Refresh to
Active/Refresh Command Time (tRFCmin) |
350ns(min.) |
Row Active Time
(tRASmin) |
32ns(min.) |
UL
Rating |
94 V -
0 |
Operating
Temperature |
0o C to +85o
C |
Storage
Temperature |
-55o C to +100o
C |