All stock codes associated to this product
HX430C15PB2K4/16, 2758919, 740617236552, 740617236569
HX430C15PB2K4/16
16GB (4GB 512M x 64-Bit x 4 pcs.)
DDR4-3000 CL15 288-Pin DIMM
DESCRIPTION
HyperX HX430C15PB2K4/16 is a kit of four 512M x 64-bit (4GB) DDR4-3000 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0 . T
otal kit capacity is 16GB. Each module has been tested to run at DDR4-3000 at a low latency timing of 15-16-16 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The JEDEC standard
electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR4-2133 CL15-15-15 @1.2V
XMP Profile #1: DDR4-3000 CL15-16-16 @1.35V
XMP Profile #2: DDR4-2666 CL14-14-14 @1.35V
Features
- Power Supply: VDD=1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD=2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- Height 2.166” (55.00mm), w/ heatsink
SPECIFICATIONS
- CL(IDD): 15 Cycles
- Row Cycle Time (tRCmin): 46.5ns(min.)
- Refresh to Active/Refresh Command Time (tRFCmin): 260ns(min.)
- Row Active Time (tRASmin): 33ns(min.)
- Maximum Operating Power: TBD W*
- UL Rating: 94 V - 0
- Operating Temperature: 0oC to +85oC
- Storage Temperature: -55oC to +100oC
