All stock codes associated to this product
HX424C15FBK4/32, 2881645, 740617240672
HX424C15FBK4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-2400 CL15 288-Pin DIMM
Description
HyperX HX424C15FBK4/32 is a kit of four 1G x 64-bit (8GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
JEDEC/XMP TIMING PARAMETERS
JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V DDR4-2133 CL14-14-14 @1.2V
XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V
Features
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Dual-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- Height 1.230” (31.25mm), w/o heatsink
SPECIFICATIONS
- CL(IDD): 15 cycles
- Row Cycle Time (tRCmin): 46.75ns(min.)
- Refresh to Active/Refresh, Command Time (tRFCmin 46.75ns(min.): 260ns(min.)
- Row Active Time (tRASmin): 29.125ns(min.)
- Maximum Operating Power: TBD W*
- UL Rating: 94 V - 0
- Operating Temperature: 0oC to +85oC
- Storage Temperature: -55oC to +100oC
