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All stock codes associated to this product
HX421S13IBK2/8
HX421S13IBK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR4-2133 CL13 260-Pin SODIMM Kit
DESCRIPTION
HyperX HX421S13IBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2133 CL13 SDRAM (Synchronous DRAM) 1Rx8, memory modules, based on eight 512M x 8-bit DDR4 FBGA components. Total kit capacity is 8GB. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2133 at a low latency timing of 13-13-13 at 1.2V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
PnP JEDEC TIMING PARAMETERS:
JEDEC/PnP: DDR4-2133 CL13-13-13 @1.2V
XMP Profile #1: DDR4-2133 CL13-13-13 @1.2V
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD = 2.25V to 3.6V
On-Die termination (ODT)
16 internal banks; 4 groups of 4 banks each
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Height 1.18 (30.00mm)
Specifications
CL(IDD): 13 Cycles
Row Cycles Time (tRCmin): 46.5ns (min.)
Refresh to Active/Refresh, Command Time (tRFCmin): 260ns (min.)
Row Active Time (tRASmin): 33ns (min.)
Maximum Operating Power: TBD W*
UL Rating: 94V - 0
Operating Temperature: 0C to 85C
Storage Temperature: -55C to + 100C