HX426C15FB/4 | Kingston 4GB (1 x 4GB) PC4-21300 2666MHz DDR4 RAM - 15-17-17

DESCRIPTION

HyperX HX426C15FB/4 is a 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:

JEDEC/XMP TIMING PARAMETERS

JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V, DDR4-2400 CL14-16-16 @1.2V, DDR4-2133 CL12-14-14 @1.2V, XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V

FEATURES

Power Supply: VDD = 1.2V Typical

VDDQ = 1.2V Typical

VPP - 2.5V Typical

VDDSPD = 2.2V to 3.6V

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

Low-power auto self refresh (LPASR)

Data bus inversion (DBI) for data bus

On-die VREFDQ generation and calibration

Single-rank

On-board I2 serial presence-detect (SPD) EEPROM

16 internal banks; 4 groups of 4 banks each

Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

Selectable BC4 or BL8 on-the-fly (OTF)

Fly-by topology

Terminated control command and address bus

Height 1.340� (34.04mm), w/heatsink

SPECIFICATIONS

CL(IDD): 15 cycles

Row Cycle Time (tRCmin): 45ns (min.)

Refresh to Active/Refresh, Command Time (tRFCmin): 260ns (min.)

Row Active Time (tRASmin): 26.25ns(min.)

Maximum Operating Power: TBD W*

UL Rating: 94V - 0

Operating Temperature: 0C to +85C

Storage Temperature: -55C to +100C