All stock codes associated to this product
HX324C11SRK2/16, 740617234626
HX324C11SRK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-2400 CL11 240-Pin DIMM
DESCRIPTION
HyperX HX324C11SRK2/16 is a kit of two 1G x 64-bit (8GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 16GB. Each module has been tested to run at DDR3-2400 at a low latency timing of 11-13-14 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMP Profile #1: DDR3-2400 CL11-13-14 @1.65V
XMP Profile #2: DDR3-2133 CL11-13-13 @1.6V
Features
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal banks
- Programmable CAS latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº
- Asynchronous Reset
- PCB: Height 1.180” (30.00mm), double sided component
SPECIFICATIONS
- CL(IDD): 11 cycles
- Row Cycle Time (tRCmin): 48.125ns(min.)
- Refresh to Active/Refresh Command Time (tRFCmin): 260ns(min.)
- Row Active Time (tRASmin): 35ns(min.)
- Maximum Operating Power: TBD W*
- UL Rating: 94 V - 0
- Operating Temperature: 0oC to +85oC
- Storage Temperature: -55oC to +100oC
Power will vary depending on the SDRAM used.
