All stock codes associated to this product
HX324C11T2K2/8
HX324C11T2K2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-2400 CL11 240-Pin DIMM Kit
Description
HyperX HX324C11T2K2/8 is a kit of two 512M x 64-bit (4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM), 1Rx8 memory modules, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB.
Each module kit has been tested to run at DDR3-2400 at a low latency timing of 11-13-14 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical
specifications are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMP Profile #1: DDR3-2400 CL11-13-14 @1.65V
XMP Profile #2: DDR3-2133 CL11-13-13 @1.6V
FEATURES
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal banks
Programmable CAS latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
Bi-directional Differential Data Strobe
Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,3.9us at 85°C < TCASE < 95°Cº
Asynchronous Reset
Height 2.122” (53.90mm), w/ heatsink, single sided component
SPECIFICATIONS
CL(IDD): 11 Cycles
Row Cycle Time (tRCmin): 48.125ns(min.)
Refresh to Active/Refresh, Command Time (tRFCmin): 260ns(min.)
Row Active Time (tRASmin): 35ns(min.)
Maximum Operating Power: TBD W*
UL Rating: 94 V - 0
Operating Temperature: 0oC to +85oC
